Speedy series: Laser engraving and cutting machines for formats up to 1016 x 610 mm
⚫ Engrave | ⚫ Cut | ⚫ Mark |
Laser type: | CO₂, Flexx or Fiber laser |
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Work area: | 610 x 305 up to 1016 x 610 mm |
Max. workpiece height: | 125 - 305 mm |
Laser power: | 20 - 120 watts |
SP series: CO2 laser cutter for large-format materials.
⚫ Engrave | ⚫ Cut | ⎯ Mark |
Laser type: | CO₂ laser |
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Work area: | 1245 x 710 up to 3250 x 3210 mm |
Max. workpiece height: | 50 - 112 mm |
Laser power: | 40 - 400 watts |
Marking laser stations with galvo marking heads. Marking area up to 44.1 x 25.0 inch.
⚫ Engrave | ⎯ Cut | ⚫ Mark |
Laser type: | CO₂ or Fiber laser |
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Max. work area: | 190 x 190 up to 1300 x 450 mm |
Max. workpiece height: | 250 - 764 mm |
Laser power: | 20 - 100 watts / 20 + 100 watts MOPA |
Laser marking of electronic and electrical components
Products in the electronics and semiconductor industry are mostly mass-market products that are produced fully and automatically in large numbers. Many parts, such as SMD components, are very small and need to be labeled with a lot of information. For this purpose small, complex 2D Data Matrix codes are used, which must be permanent and easily legible. Due to these requirements, the electronics industry has already made laser marking a standard procedure. Galvo laser systems allow for a trouble-free, quick, fully or semi-automated labeling process.
Electronic components and PCB boards are marked with permanent, solder resistant and easy-to-read laser markings. These labels serve as identification for traceability, internal quality assurance or trademark protection. Another application in the electronics industry is laser cutting of flame retardant electrical insulating foils that act as a separator between electronic components and printed circuit boards. In prototype construction, the CO₂ laser offers advantages over conventional methods, such as punching.
Laser marking systems are capable of permanently and quickly engraving most materials that are used in the electronics and semiconductor industry with a high-contrast finish. Depending on the requirements and piece numbers, they can be introduced as a stand-alone laser workstation or fully integrated into the production line.
The laser works contactless, i.e. in contrast to classical mechanical engraving, the workpiece does not have to be fixated in the laser device. The casings of electronic devices are mostly made of anodized aluminum. Since CO2 lasers can process metals, if at all, only with additional implements, the metal surface remains intact.
When marking with CO2 lasers, it is necessary to apply a special paste or spray, which must be applied to the workpiece and dried before the laser process. The marking is then burned into the metal with the laser.
After the laser process, the residues of the paste or spray must be washed off. For this operation, a lot of energy is required; thus, the laser must be moved at an appropriately low speed. On some metals, high contrast can be achieved by using this process, while it should be noted that not all metals are suitable for paste or spray marking. The necessary pastes or sprays are very expensive, and the whole process is very time-consuming. It is possible for metals to be directly marked with a fiber laser. There is a distinction made between engraving, annealing marking, and coating ablation. The devices of the Speedy flexx series are equipped with a CO2 and a fiber laser. You can use both laser sources in a single job without having to manually change the laser source, the lenses or the focus. The patented JobControl® laser software makes it possible: Simply assign the desired laser source to each color of the graphic.