English > Solutions > Laser Infos > How does a laser beam work? 

Generation of a Laser Beam  

The term "LASER" is an acronym for Light Amplification by Stimulated Emission of Radiation. Lasers amplify light by absorbing and radiating energy. Laser radiation is created in a laser source by supplying a concentrated energy to a laser medium, such as a solid crystal (Nd:YAG, Nd:YLF, etc.) or a gas compound (CO2, Helium-Neon, etc.), to stimulate or "pump" atoms to spontaneously emit light. An energy source is used to generate this concentrated energy such as a high intensity lamp, an electrical discharge, or even a diode laser. The laser medium is located between two mirrors, creating a laser resonator that amplifies light continuously and produces a specific wavelength of laser light. One of the mirrors, the coupling mirror, is partially permeable to this specific wavelength and allows some of the laser light to escape. Laser light is then passed through a lens to focus it into an extremely high energy density laser beam. 

Laser Beam 
 

 

Laser Beam Performance


Due to the exceptional dynamics of the laser beam and its remarkable high energy density, it can be applied to process materials with excellent results. Laser processing can be accomplished through many methods by adjusting the parameters of the laser, although the most popular applications use vaporization or melting of the target material. Using positioning mirrors, the laser beam can be directed over large distances without any loss in efficiency. These mirrors are generally controlled by accurate X-Y Plotter mechanics or high speed Galvanometers. Trotec typically uses sealed-off CO2 gas lasers and diode pumped solid state Nd:YAG lasers, because these types of lasers have been proven to produce high-quality, consistent results. The laser beam provides a universal, non-contact, wear-free production material processing solution that is economical to operate and simple to implement. A laser beam is ideally suited for engraving, marking, etching, scribing, and cutting operations.